Nanotechnology Now – Press Release: Avera Semi and OCP Announce New Open, Physical Interconnect Specification to Efficiently Connect Chiplets

Home > Press > Avera Semi and OCP Announce New Open, Physical Interconnect Specification to Efficiently Connect ChipletsAbstract:Bunch of Wires (BoW) specification, developed in conjunction with members of the OCP’s Open Domain-Specific Architecture (ODSA) sub-project, to be made open and publicly available. Avera Semi and OCP Announce New Open, Physical...